The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its top feature.

Royal technology team assisted our customer to develope the DPC process successfully with PVD sputtering technology.

Keywords: Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al₂O₃, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor

Applications of DPC: 

· HBLED

· Substrates for solar concentrator cells

· Power semiconductor packaging including automotive motor control

· Hybrid and electric automobile power management electronics

· Packages for RF

· Microwave devices

DPC Technology Performance 
Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si

• Lower production cost.
• Outstanding thermal management and heat-transfer performance
• Accurate alignment and pattern design
• Robust metallization adhesion