General Information About PVD Process

PVD processes is atomic deposition process in which material vaporized from a source is transported in the form of a vapor through a vacuum or low-pressure gaseous or plasma environment to the substrate, where it condenses. PVD processes can be used to deposit films of elements and molecules and also of compound materials by the reaction of depositing material with the ambient gas environment. ( e.g., TiN ) or with a co-depositing material (e.g. TiC ). Typically, PVD processes are used to deposit films with thickness in the range of a few nanometers to thousands of nanometers; however, they can be used to form graded-composition deposits of multi-layer coatings, very thick deposits, and freestanding structures.

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