PVD Functional Coatings- Gold Sputtering Thin Film Deposition System
Gold has a bright, reddish-yellow color in its purest form. It does not oxidize in the air at room temperature, so it remains very stable under normal conditions and its electrical conductivity is constant. It is one of the most common precious metals used in finishing.
Gold is corrosion resistant, which makes it a good finish for connector pins and electrical switch contacts.
Gold plating is used in parts and components across a wide range of main industries:
- Medical applications: body implants
- Energy: hydrogen fuel cell Bipolar plates
- Semiconductor: microelectronic chips
- Aerospace & defense
- Telecommunications and other more
ROYAL Technology supplies turnkey coating solutions for manufactures who are looking for a reliable team for long term cooperation.
Robust design, large batches, fast cycle, flexible coating processes are the basic design concepts ROYAL Team has been pursuing.
Design Advantages
- Energy saving: compact design and molecular pumps are applied
- High target utilization up to 40% with planar sputtering cathode
- Sputtered Au gold film’s thickness is controllable
- One-Touch operation system
PVD Gold sputtering deposition
- When comes to glass, metal alloys etc. Substrates material, the bonding layer is essential to enhance substrate and Aufilm adhesion. Royal Technology has developed a range of matured coating recipes based on different applications, support our customers with professional advice.
- The roughness (RMS – root mean square) < 40Å is expected for most of the applications. For certain scanning probe applications a lower roughness might be required, generally 1.5 ~ 4 nm.
- Gold sputtering layer surface purity: a clean surface is required for applications that employ gold surface modifications. Depending on the PVD process used, level of vacuum in the system, original purity of the gold source (over 99.99% generally)
Please contact us for more information, we are always open to communicate and share with you the advanced techniques.
Technical Specifications:
MODEL: RTSP800
TECHNOLOGY: DC Sputtering + Ion source (for option)
MATERIAL: Stainless Steel
CHAMBER SIZE: Φ800*H800mm
CHAMBER TYPE: Cylinder, vertical, 1-door
ROTARY RACK SYSTEM: Planetary/Central driving
DEPOSITION MATERIAL: Gold, Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium
DEPOSITION SOURCE: Planar Sputtering Cathodes,
Conventional arc cathodes for option(according to the coating process’s requirement)
REACTIVE GAS CONTROL: MFC, 2/4 ways
CONTROL PLC(Programmable Logic Controller) +IPC
PUMP SYSTEM：
SV300B – 1 set (Leybold) 300m³/hr
Roots Pump – 1 set, 490m³/hr
Holding Pump – 1 set, 60m³/hr
Turbo Molecular Pump: – 1 set, 3500L/S
POWER SUPPLY： Bias power supply: 1*24 KW
DC sputtering power: 12KW
Linear Ion source: 5KW
SAFETY SYSTEM：Numerous safety interlocks to protect operators and equipment
COOLING Recycle: Cooling Water
HEATING: Heaters, 9KW
POWER ELECTRICAL:
480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT: L3200*W2600*H2000mm
TOTAL WEIGHT: 4.0 T
CYCLE TIME: 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions)
POWER MAX: 50KW
AVERAGE POWER CONSUMPTION (APPROX.): 20KW
Built Time: 2016
Location: Shanghai, China
